Please use this identifier to cite or link to this item:
https://dspace.ctu.edu.vn/jspui/handle/123456789/61904
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Dang, Thi Tuyet Ngan | - |
dc.contributor.author | Tran, Trung Kien | - |
dc.contributor.author | Wang, Da-Ming | - |
dc.date.accessioned | 2021-08-18T07:28:40Z | - |
dc.date.available | 2021-08-18T07:28:40Z | - |
dc.date.issued | 2021 | - |
dc.identifier.issn | 2525-2518 | - |
dc.identifier.uri | https://dspace.ctu.edu.vn/jspui/handle/123456789/61904 | - |
dc.description.abstract | Supported liquid membrane with strip dispersion (SLMSD) is a promising process for metal recovery from e-waste or waste streams because of many advantages such as the ability to combine extraction and stripping into one single step and thus have non-equilibrium mass transfer characteristics and maximum driving force. This paper investigated the effect of important factors on SLMSD performance to recover indium from etching solution such as: pH of feed solution, extractant (Di-(2-ethylhexyl) phosphoric acid (D2EHPA)) concentration, oxalic acid concentration. It was found that 99.5 % In3+ was removed from feed solution in about 20 minutes with high concentration factor (4.5) under suitable conditions (pH 1; 0.6M Di-(2ethylhexyl) phosphoric acid (D2EHPA), 2 wt% oxalic acid). | vi_VN |
dc.language.iso | en | vi_VN |
dc.relation.ispartofseries | Vietnam Journal of Science and Technology;Vol.59, No.01 .- P.90-95 | - |
dc.subject | Liquid membrane | vi_VN |
dc.subject | SLMSD | vi_VN |
dc.subject | Indium recovery | vi_VN |
dc.subject | Etching solution | vi_VN |
dc.subject | D2EHPA | vi_VN |
dc.title | Supported liquid membrane with strip dispersion for recovering indium from etching solution of LCD industry: Influence of factors on performance | vi_VN |
dc.type | Article | vi_VN |
Appears in Collections: | Vietnam journal of science and technology |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
_file_ Restricted Access | 1.15 MB | Adobe PDF | ||
Your IP: 18.117.119.34 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.